Altium

Design Rule Verification Report

Date: 12/1/2025
Time: 3:08:37 PM
Elapsed Time: 00:00:00
Filename: C:\Users\Public\Documents\Altium\TP_Board\Header_to_TP.PcbDoc
Warnings: 0
Rule Violations: 42

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=10mil) (All),(All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Modified Polygon (Allow modified: No), (Allow shelved: No) 0
Width Constraint (Min=10mil) (Max=10mil) (Preferred=10mil) (All) 0
Routing Topology Rule(Topology=Shortest) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Hole Size Constraint (Min=1mil) (Max=100mil) (All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Minimum Solder Mask Sliver (Gap=10mil) (All),(All) 38
Silk To Solder Mask (Clearance=10mil) (IsPad),(All) 4
Silk to Silk (Clearance=10mil) (All),(All) 0
Net Antennae (Tolerance=0mil) (All) 0
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All) 0
Total 42

Minimum Solder Mask Sliver (Gap=10mil) (All),(All)
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-01(3402.52mil,4130.906mil) on Top Layer And Pad J1-03(3434.016mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-02(3402.52mil,3975mil) on Top Layer And Pad J1-04(3434.016mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-03(3434.016mil,4130.906mil) on Top Layer And Pad J1-05(3465.512mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-04(3434.016mil,3975mil) on Top Layer And Pad J1-06(3465.512mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-05(3465.512mil,4130.906mil) on Top Layer And Pad J1-07(3497.008mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-06(3465.512mil,3975mil) on Top Layer And Pad J1-08(3497.008mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-07(3497.008mil,4130.906mil) on Top Layer And Pad J1-09(3528.504mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-08(3497.008mil,3975mil) on Top Layer And Pad J1-10(3528.504mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-09(3528.504mil,4130.906mil) on Top Layer And Pad J1-11(3560mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-10(3528.504mil,3975mil) on Top Layer And Pad J1-12(3560mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-11(3560mil,4130.906mil) on Top Layer And Pad J1-13(3591.496mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-12(3560mil,3975mil) on Top Layer And Pad J1-14(3591.496mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-13(3591.496mil,4130.906mil) on Top Layer And Pad J1-15(3622.992mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-14(3591.496mil,3975mil) on Top Layer And Pad J1-16(3622.992mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-15(3622.992mil,4130.906mil) on Top Layer And Pad J1-17(3654.488mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-16(3622.992mil,3975mil) on Top Layer And Pad J1-18(3654.488mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-17(3654.488mil,4130.906mil) on Top Layer And Pad J1-19(3685.984mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-18(3654.488mil,3975mil) on Top Layer And Pad J1-20(3685.984mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-19(3685.984mil,4130.906mil) on Top Layer And Pad J1-21(3717.48mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-20(3685.984mil,3975mil) on Top Layer And Pad J1-22(3717.48mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-21(3717.48mil,4130.906mil) on Top Layer And Pad J1-23(3748.976mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-22(3717.48mil,3975mil) on Top Layer And Pad J1-24(3748.976mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-23(3748.976mil,4130.906mil) on Top Layer And Pad J1-25(3780.472mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-24(3748.976mil,3975mil) on Top Layer And Pad J1-26(3780.472mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-25(3780.472mil,4130.906mil) on Top Layer And Pad J1-27(3811.968mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-26(3780.472mil,3975mil) on Top Layer And Pad J1-28(3811.968mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-27(3811.968mil,4130.906mil) on Top Layer And Pad J1-29(3843.465mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-28(3811.968mil,3975mil) on Top Layer And Pad J1-30(3843.465mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-29(3843.465mil,4130.906mil) on Top Layer And Pad J1-31(3874.961mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-30(3843.465mil,3975mil) on Top Layer And Pad J1-32(3874.961mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-31(3874.961mil,4130.906mil) on Top Layer And Pad J1-33(3906.457mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-32(3874.961mil,3975mil) on Top Layer And Pad J1-34(3906.457mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-33(3906.457mil,4130.906mil) on Top Layer And Pad J1-35(3937.953mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-34(3906.457mil,3975mil) on Top Layer And Pad J1-36(3937.953mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-35(3937.953mil,4130.906mil) on Top Layer And Pad J1-37(3969.449mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-36(3937.953mil,3975mil) on Top Layer And Pad J1-38(3969.449mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-37(3969.449mil,4130.906mil) on Top Layer And Pad J1-39(4000.945mil,4130.906mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
Minimum Solder Mask Sliver Constraint: (3.496mil < 10mil) Between Pad J1-38(3969.449mil,3975mil) on Top Layer And Pad J1-40(4000.945mil,3975mil) on Top Layer [Top Solder] Mask Sliver [3.496mil]
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Silk To Solder Mask (Clearance=10mil) (IsPad),(All)
Silk To Solder Mask Clearance Constraint: (9.842mil < 10mil) Between Pad J1-01(3402.52mil,4130.906mil) on Top Layer And Track (3378.74mil,3990.354mil)(3378.74mil,4115.551mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.842mil]
Silk To Solder Mask Clearance Constraint: (9.842mil < 10mil) Between Pad J1-02(3402.52mil,3975mil) on Top Layer And Track (3378.74mil,3990.354mil)(3378.74mil,4115.551mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.842mil]
Silk To Solder Mask Clearance Constraint: (9.842mil < 10mil) Between Pad J1-39(4000.945mil,4130.906mil) on Top Layer And Track (4024.724mil,3990.354mil)(4024.724mil,4115.551mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.842mil]
Silk To Solder Mask Clearance Constraint: (9.842mil < 10mil) Between Pad J1-40(4000.945mil,3975mil) on Top Layer And Track (4024.724mil,3990.354mil)(4024.724mil,4115.551mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.842mil]
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